Intel’s EMIB was the foundation of the Kaby Lake-G partnership with AMD. Intel’s Foveros stacked-die technology produced the upcoming Lakefield chip. Now Intel is combining EMIB and Foveros into what it’s calling “co-EMIB,” alongside a more advanced ODI interface.
Both technologies will “improve product-level performance, power and area while enabling a complete rethinking of system architecture,” Intel said in a blog post. Both represent advances in how the chips are packaged and connected, rather than changes in the underlying silicon or the overall microarchitecture.